Characteristics and application of aluminum oxide ceramic metallization products

Under the premise of ensuring the quality of alumina ceramics, it has realized the metal language, which is to firmly adhere a metal film on the surface of the alumina ceramic to make the welding between ceramic and metal. At present, there are many methods for completing the metallization of alumina ceramics, including molybdenum and manganese methods, gold plating methods, copper plating methods, tin plating methods, nickel plating methods, LAP methods, and the like.

    The alumina ceramic product after metallization has strong bonding force of metal and ceramic; the joint of metal and ceramic is dense, and the heat dissipation is good. It is with the advantages of this series that alumina ceramics can be widely used in LED heat sink substrates, ceramic packages, electronic circuit boards, and the like.

    In order to ensure the quality, before the metallization and sealing of the alumina ceramics, the connected ceramics must be processed according to certain requirements to achieve the conditions of no burrs, no protrusions, smooth and clean porcelain. Provide a good foundation for metallization.

    Since alumina ceramics can be used in electronic circuit boards, it is also a very representative electronic ceramic. Through precise control of surface, grain boundary and standard structure, it has achieved a series of excellent functions and is widely used. A sintered body material for producing an electronic functional component.

    The manufacturing skill of alumina ceramics as an electronic ceramic is roughly the same as that of traditional ceramics, but it is essentially different from general electrical ceramics in terms of chemical composition, microstructure, and electromechanical function, so it cannot be confused.